Technology that moves electronics with precision

The production of integrated circuits starts with wafer production – from crystal growing and cutting to grinding. High throughput and maximum reliability are essential to meet the growing demand for semiconductors.
In the Front-End processes (FEOL) such as lithography, coating and wafer handling, drive solutions must operate under cleanroom and vacuum conditions while ensuring highest precision and minimal particle emission.
The Back-End processes (BEOL) – including singulation, interconnection and encapsulation – require compact and dynamic systems for accurate positioning in extremely limited space. These solutions help secure product quality and efficiency throughout the entire semiconductor manufacturing chain.

Flat Panel Display (FPD) manufacturing faces major challenges: larger screen sizes and new technologies like OLED or Micro-LED demand highly precise and dynamic automation solutions.
Drive systems must support sensitive processes such as coating, lithography, etching and bonding with outstanding positioning accuracy and smooth operation. For automated production lines, Material Handling & Automation solutions are key – ensuring flexibility, compact design and high productivity for transporting and positioning even large panels.

Electronics assembly is characterized by an extremely high degree of automation. PCB placement, fine positioning and end-of-line testing require drive solutions that combine high dynamics, precision and low weight in a compact footprint.
Modular systems enable flexible adaptation to different production volumes and help increase machine performance. For complex handling tasks, solutions for Material Handling & Automation ensure precise movements and positioning even at high cycle rates – securing quality and productivity in automated assembly lines.